Book Your Technical Training During Spring 2026

Specialized Technical Training for Engineers

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Course Calendar

EMC, SI, PI.

070 High-Speed PCB Design for EMC and Signal Integrity

Location: Gothenburg, Sweden Date: June 22 - June 26, 2026 Duration: 5 days
Instructor: Mr. Elya B. Joffe. All EMI problems begin and end on the Printed Circuit Board. In recent years, PCBs have become increasingly complex. The use of high density VLSI on the one hand, combined with the increased processing speed and data rates on the other hand, have led to the increased density of the circuits. The use of high speed/high edge rate digital circuits, along with the need for low power consumption, have contributed to higher electromagnetic emissions from circuits, on the one hand, and increased sensitivity of the circuits on the other, leading to Electromagnetic Interference (EMI) problems. A special problem is that of Signal Integrity (SI). For the adequate control of EMI, strict international standards and regulations have been developed worldwide. These standards require the suppression of electromagnetic emissions from circuits and systems, and their increased immunity to externally induced interference. The proper design of PCBs is a cost effective approach for the control of EMI in high-speed circuits. Read full course description including course schedule.

Early Bird
3 540,00 3 935,00 
Early Bird Price Ends: April 22, 2026

EMC, SI, PI.

071 Transients and Electrical Overstress Protection in Electronic Systems

Location: Amersfoort, The Netherlands Date: May 18 - May 20, 2026 Duration: 3 days
Instructor: Mr. Elya B. Joffe. Modern electronics are extremely vulnerable to electrical transients and overstress, which are “predictably unpredictable”. Protection measures can be designed and implemented, are available, but many businesses are not aware of the threat and/or not willing to invest the time or money: There is a prevailing “It Can’t Happen” attitude. This 3-day course will provide the engineering know-how, to describe transient protection and mitigation techniques and to provide the technical tools enabling the engineer to analyze the vulnerability of equipment and design protection of product, systems and facilities, to transients and electrical overstress in electronic circuits and installations, in order to meet the applicable standards and codes. Read full course description including course schedule.

2 535,00 
 

Semiconductors Technology

075 Heterogeneous integration of chiplets – Defect inspection, metrology and failure analysis

Location: Gothenburg, Sweden Date: June 22 - June 24, 2026 Duration: 3 days
Instructor: Dr. Ehrenfried Zschech Expand your knowledge of the processing, materials, performance, and reliability aspects of heterogeneous integration of chiplets. Let Professor Zschech guide you all the way from 3D advanced packaging technologies through fault isolation and failure analysis up to the kinetics of degradation processes and reliability challenges. This course will include novel aspects of high-performance computing and AI applications that are driving the demand for increased functionality, performance, and reliability. Read full course description including course schedule.

Early Bird
2 280,00 2 535,00 
Early Bird Price Ends: April 22, 2026

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