Instructor: Dr. Maxime Darnon This course is intended to provide an understanding of plasma processes for CMOS applications and ULSI technology. We will discuss fundamental and practical aspects of front end and back end plasma processes for deep submicron CMOS logic processes. The course is based on experimental results obtained using commercial etchers connected to very powerful diagnostics of the plasma and the plasma surface interaction. The discussions cover several aspects of etch processes of materials integrated in advanced CMOS devices, etch mechanisms, and situations that may be encountered for some important plasma processes. Option 2: Take the short Ecourse #089 Plasma Etching for Microelectronics Applications. Combining self-paced e-learning with live weekly sessions with the instructor. Duration in total is two weeks of effective learning. Content based on the first two days of the public course #088. Option 3: Take the full Ecourse #090 Plasma Etching for Microelectronics Applications: from Fundamental to Practical Applications. Combining self-paced e-learning with live weekly sessions with the instructor. Duration in total is four weeks of effective learning. Content based on complete agenda of the public course #088. Read full course description including course schedule